spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 1 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 3.5x3.5 mm smd chip led lamp attention observe precautions for handling electrostatic discharge sensitive devices part number: AA3535SYL1Z1S super bright yellow features z white smd package, silicone resin. z low thermal resistance. z compatible with ir-reflow processes. z esd protection. z package: 2000pcs / reel. z moisture sensitivity level : level 2a. z rohs compliant. package dimensions applications z signal and symbol luminaire for orientation. z marker lights (e.g. steps, exit ways, etc). z decorative and entertainment lighting. z commercial and residential lighting. z automotive interior lighting. description the source color devices are made with algainp light emitting diode. static electricity and surge damage the leds. it is recommended to use a wrist band or anti-electrostatic glove when handling the leds. all devices, equipment and machinery must be electrically grounded. notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications.
spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 2 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 4. the outer diameter of the smd pickup nozzle should not exceed t he size of the led to prevent air leaks. the inner diameter of the nozzle should be as large as possible. 5. a pliable material is suggested for the nozzle tip to avoid scratching or damaging the led surface during pickup. 6. the dimensions of the component must be accurately progra mmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry.
spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 3 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 absolute maximum ratings at t a =25c electrical / optical characteristics at t a =25c notes: 1.results from mounting on pc board fr4(pad size 70mm 2 ), mounted on pc board-metal core pcb is recommend for lowest thermal resistance. 2.1/10 duty cycle, 0.1ms pulse width. parameter symbol value unit power dissipation p d 525 mw junction temperature [1] t j 130 c operating temperature top -40 to +85 c storage temperature ts t g -40 to +85 c dc forward current [1] i f 150 ma peak forward current [2] i fm 270 ma thermal resistance [1] (junction/ambient) r th j-a 178 c/w thermal resistance [1] (junction/solder point) r th j-s 78 c/w 8000 v electrostatic dischar ge threshold (hbm) reverse voltage v r 5 v selection guide notes: 1.wavelength: +/-1nm. 2. forward voltage: +/-0.1v. parameter symbol value unit wavelength at peak emission i f =150ma [typ.] peak 590 nm dominant wavelength i f =150ma [typ.] dom [1] 590 nm spectral line half-width i f =150ma [typ.] ? 20 nm forward voltage i f =150ma [min.] v f [2] 2.5 v forward voltage i f =150ma [typ.] 3.0 forward voltage i f =150ma [max.] 3.5 temperature coefficient of peak i f =150ma, -10 c t 100 c [typ.] tc peak 0.13 nm/ c temperature coefficient of dom i f =150ma, -10 c t 100 c [typ.] tc dom 0.10 nm/ c temperature coefficient of v f i f =150ma, -10 c t 100 c [typ.] tc v -3.3 mv/ c reverse current (v r = 5v) [max.] i r 10 ua part no. dice lens type iv (cd) [2] @ 150ma v iewing angle [1] min. typ. min. typ. 2 1/2 AA3535SYL1Z1S super bright yellow(algainp) water clear 2.8 4 6 8 120 v (lm) [2] @ 150ma notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity/ luminous flux: +/-15%.
spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 4 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 super bright yellow AA3535SYL1Z1S
spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 5 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 AA3535SYL1Z1S reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. recommended soldering pattern (units : mm; tolerance: 0.1) tape specifications (units : mm) reel dimension
spec no: dsaj4025 rev no: v.4 date: sep/24/2010 page: 6 of 6 approved: wynec checked: allen liu drawn: y.h.wu erp: 1201004888 packing & label specifications AA3535SYL1Z1S
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